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SMBG5913 thru SMBG5956B, e3

SMBJ5913 thru SMBJ5956B, e3

SILICON 2.0 Watt ZENER DIODES

SCOTTSDALE DIVISION

DESCRIPTION

The SMBJ5913-5956B or SMBG5913-5956B series of surface mount 2.0

watt Zeners provides voltage regulation in a selection from 3.3 to 200

volts with different tolerances as identified by suffix letter on the part

number. This series is equivalent to the JEDEC registered 1N5913 thru

1N5956B with identical electrical characteristics except it is rated at 2.0 W

instead of 1.5 W with the lower thermal resistance features of the surface

mount packaging. It is available in J-bend design (SMBJ) with the DO-

214AA package for greater PC board mounting density or in Gull-wing

design (SMBG) in the DO-215AA for visible solder connections. It is also

available as RoHS Compliant with an e3 suffix. Microsemi also offers

numerous other Zener products to meet higher and lower power

applications.

IMPORTANT:

For the most current data, consult

MICROSEMI’s

website:

http://www.microsemi.com

APPEARANCE

WWW .

Microsemi

NOTE: All SMB series are

equivalent to prior SMS package

identifications.

FEATURES

•

Surface mount equivalent to 1N5913 to 1N5956B

Ideal for high-density and low-profile mounting

Zener voltage available 3.3V to 200V

Standard voltage tolerances are plus/minus 5% with

B suffix and 10 % with A suffix identification

•

Tight tolerances available in plus or minus 2% or 1%

with C or D suffix respectively

•

Options for screening in accordance with MIL-PRF-19500

•

APPLICATIONS / BENEFITS

Regulates voltage over a broad operating

current and temperature range

Wide selection from 3.3 to 200 V

Popular DO-214AA or DO-215AA packages

and footprints for either high density J-bend or

Gull-wing designs for visible solder joints

Nonsensitive to ESD per MIL-STD-750 Method

1020

Withstands high surge stresses (see Figure 2)

Moisture classification: Level 1 per IPC/JEDEC

J-STD-020B with no dry pack required

MECHANICAL AND PACKAGING

•

CASE: Void-free transfer molded

thermosetting epoxy body meeting UL94V-0

•

TERMINALS: Gull-wing or C-bend (modified

J-bend) tin-lead or RoHS compliant annealed

matte-Tin plating solderable per MIL-STD-750,

method 2026

•

POLARITY: Cathode indicated by band.

Diode to be operated with banded end positive

with respect to opposite end for Zener

regulation

•

MARKING: Includes part number without

prefix (e.g. 5913B, 5913Be3, 5948C, 5956D,

etc.)

•

TAPE & REEL option: Standard per

EIA-481-1-

with 12 mm tape, 750 per 7 inch reel or 2500

per 13 inch reel

(add “TR” suffix to part number)

•

WEIGHT: 0.1 grams

•

See package dimensions on last page

for JAN, JANTX, and JANTXV are available by adding MQ,

MX, or MV prefixes respectively to part numbers.

•

RoHS Compliant devices available by adding an “e3” suffix

MAXIMUM RATINGS

•

Power dissipation at 25

C: 2.0 watts (also see

derating in Figure 1).

Operating and Storage temperature: -65

C to

+150

Thermal Resistance: 35

C/W junction to lead, or

100

C/W junction to ambient when mounted on FR4

PC board (1oz Cu) with recommended footprint (see

last page)

Steady-State Power: 2 watts at T

< 80

C, or 1.25

watts at T

= 25

C when mounted on FR4 PC board

with recommended footprint (also see Figure 1)

Forward voltage @200 mA: 1.2 volts (maximum)

Solder Temperatures: 260

C for 10 s (maximum)

SMBG(J)5913–5956B, e3

•

2007

6-21--2007 REV H

Microsemi

Scottsdale Division

8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503

Page 1

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